发明申请
- 专利标题: Methods of bridging lateral nanowires and device using same
- 专利标题(中): 桥接横向纳米线的方法及其使用方法
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申请号: US10738176申请日: 2003-12-17
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公开(公告)号: US20050133476A1公开(公告)日: 2005-06-23
- 发明人: M. Islam , Theodore Kamins , Shashank Sharma
- 申请人: M. Islam , Theodore Kamins , Shashank Sharma
- 主分类号: D01F9/127
- IPC分类号: D01F9/127 ; H01L21/768 ; H01L23/532 ; H01L51/30 ; C23F1/00
摘要:
A semiconductor nanowire is grown laterally. A method of growing the nanowire forms a vertical surface on a substrate, and activates the vertical surface with a nanoparticle catalyst. A method of laterally bridging the nanowire grows the nanowire from the activated vertical surface to connect to an opposite vertical surface on the substrate. A method of connecting electrodes of a semiconductor device grows the nanowire from an activated device electrode to an opposing device electrode. A method of bridging semiconductor nanowires grows nanowires between an electrode pair in opposing lateral directions. A method of self-assembling the nanowire bridges the nanowire between an activated electrode pair. A method of controlling nanowire growth forms a surface irregularity in the vertical surface. An electronic device includes a laterally grown nano-scale interconnection.
公开/授权文献
- US07208094B2 Methods of bridging lateral nanowires and device using same 公开/授权日:2007-04-24
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