发明申请
- 专利标题： Wafer protection device
- 专利标题（中）： 晶圆保护装置
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申请号： US11021298申请日： 2004-12-22
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公开(公告)号： US20050139939A1公开(公告)日： 2005-06-30
- 发明人: Hung-Sheng Hu , Wei-Lin Chen
- 申请人： Hung-Sheng Hu , Wei-Lin Chen
- 专利权人： BENO CORPORATION
- 当前专利权人： BENO CORPORATION
- 优先权： TW91100229 20020110
- 主分类号： B44C1/22
- IPC分类号： B44C1/22 ; B81C1/00 ; C03C15/00 ; C03C25/68 ; C23F1/00 ; H01L21/00 ; H01L21/306 ; H01L21/68 ; H01L27/14 ; H01L29/82 ; H01L29/84
摘要：
A wafer protection device. The wafer has a first surface etched with an etching fluid and a second surface, and the wafer protection device is applied to the wafer to prevent a specific area on the second surface of the wafer from etching. The wafer protection device has a body and a pressure modulating device. The body covers the specific area of the wafer and provides an isolated cavity between the body and the specific area to prevent the specific area from contacting the etching fluid, and the pressure modulating device is provided on the body and connected to the isolated cavity to modulate pressure in the isolated cavity.
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