发明申请
US20050145267A1 Controls of ambient environment during wafer drying using proximity head
失效
使用接近头进行晶片干燥时的环境环境控制
- 专利标题： Controls of ambient environment during wafer drying using proximity head
- 专利标题（中）： 使用接近头进行晶片干燥时的环境环境控制
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申请号： US10817398申请日： 2004-04-01
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公开(公告)号： US20050145267A1公开(公告)日： 2005-07-07
- 发明人: Mikhail Korolik , John de Larios , Mike Ravkin
- 申请人： Mikhail Korolik , John de Larios , Mike Ravkin
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corp.
- 当前专利权人： Lam Research Corp.
- 当前专利权人地址： US CA Fremont
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B08B3/04 ; H01L21/00 ; B08B3/00
摘要：
A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.
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