发明申请
- 专利标题： Thin bond-line silicone adhesive composition and method for preparing the same
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申请号： US11062040申请日： 2005-02-18
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公开(公告)号： US20050148721A1公开(公告)日： 2005-07-07
- 发明人: Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
- 申请人： Sandeep Tonapi , Hong Zhong , Florian Schattenmann , Jennifer David , Kimberly Saville , Arun Gowda , David Esler , Ananth Prabhakumar
- 主分类号： C08L83/04
- IPC分类号： C08L83/04 ; C09J183/04 ; H01L23/373 ; H01L23/42 ; C08K3/34
摘要：
Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
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