发明申请
- 专利标题: Method and device for processing fragile material
- 专利标题(中): 处理易碎材料的方法和装置
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申请号: US10507325申请日: 2003-03-12
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公开(公告)号: US20050150254A1公开(公告)日: 2005-07-14
- 发明人: Hideki Morita , Yasuhide Otsu , Tatsuo Eda
- 申请人: Hideki Morita , Yasuhide Otsu , Tatsuo Eda
- 优先权: JP2002-066934 20020312
- 国际申请: PCT/JP03/02961 WO 20030312
- 主分类号: B23K26/03
- IPC分类号: B23K26/03 ; B23K26/40 ; C03B33/09 ; C07C1/00
摘要:
Setting in advance an absorptance of a light L (for example laser light) of a brittle material W to be processed, an absorptance of a plate-shaped sample S of the same material as the brittle material W to be processed is calculated using that set value of absorptance, a thickness of the tabular sample S when that sample S is irradiated by the light L having a same wavelength as that irradiated onto the brittle material, and based on this calculated value of absorptance, and the actual absorptance data obtained by the actual irradiation of the light L on the sample S, a light wavelength that is selected appropriate for the absorptance of the brittle material to be processed is selected, and processing of the brittle material W is carried out using light of the selected wavelength.
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