发明申请
- 专利标题： Integrated circuit device packaging structure and packaging method
- 专利标题（中）： 集成电路器件封装结构及封装方法
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申请号： US11073724申请日： 2005-03-08
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公开(公告)号： US20050151217A1公开(公告)日： 2005-07-14
- 发明人: Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
- 申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 优先权： JP2002-116321 20020418
- 主分类号： H01L31/02
- IPC分类号： H01L31/02 ; G11B7/24 ; G11B7/26 ; H01L21/00 ; H01L23/02 ; H01L23/28 ; H01L25/16 ; H01L27/14 ; H01L27/15 ; H01L31/00 ; H01L31/0203 ; H01L31/0232 ; H01L31/12 ; H01L33/00
摘要：
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.