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发明申请
US20050167813A1 Method and apparatus for molding module electronic devices and a module electronic device molded thereby 失效
用于模制模块电子装置的方法和装置以及由此模制的模块电子装置

Method and apparatus for molding module electronic devices and a module electronic device molded thereby
摘要：
In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;22) which covers the base board (23) with the terminals (24) exposed to the outside is obtained.
摘要（中）：

在模块化电子装置的成型方法中，设置在基板（23）上的多个端子（24）中的每一个的外边缘部分（24a，...）通过弯曲部分（30°R）进行压力变形处理 当上模具（30）与下模具（31）接触以形成上模具和下模具之间的模制空间时，上模具（30）被成形为弯曲的外端部分（24a） （30），其中基板（23）定位在其中，然后在上模具（30）的弯曲部分（30 R）与所述基板（23）紧密接触的状态下，用可溶性树脂填充所述模制空间 在多个端子（24）中的每一个的弯曲的外端部分（24a），最后，在模制空间中的溶解树脂（36）已经固化之后，上模具和下模具（30; 31）彼此分离， 模块电子装置，设置有基板（23），多个端子（24）各自具有铜 获得外露端部（24a）和覆盖基板（23）的树脂模制部分（21; 22），端子（24）暴露于外部。

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