First, a first electrode layer 4, a piezoelectric layer 5, a second electrode layer 6 and an oscillation layer 7 are stacked in this order over one surface of a silicon substrate 1. Next, an ink chamber partition 8 and a nozzle plate 11 are stacked over the oscillation layer 7. Subsequently, the silicon substrate 1 is ground away to a predetermined thickness from a surface thereof opposite to the first electrode layer 4, and then a remnant silicon substrate 13 is dry etched away. Thereafter, the first electrode layer 4 is patterned to form a plurality of inkjet mechanisms 2, 2, . . . . Finally, the plurality of inkjet mechanisms 2, 2, . . . are divided to simultaneously fabricate a plurality of inkjet heads 3, 3, . . . .