发明申请
US20050168960A1 Module with a built-in component, and electronic device with the same
有权
模块具有内置组件，电子设备具有相同的功能
- 专利标题： Module with a built-in component, and electronic device with the same
- 专利标题（中）： 模块具有内置组件，电子设备具有相同的功能
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申请号： US11043123申请日： 2005-01-27
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公开(公告)号： US20050168960A1公开(公告)日： 2005-08-04
- 发明人: Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama
- 申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama
- 优先权： JPP2004-022963 20040130
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/98 ; H01L23/498 ; H01L23/538 ; H01L25/065 ; H01L25/10 ; H01L25/16 ; H05K1/00 ; H05K1/18 ; H05K3/20 ; H05K3/40
摘要：
A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface; and an electronic component 32 which is disposed within the sheet substrate.