发明申请
- 专利标题： Substrate attaching method
- 专利标题（中）： 基板贴附法
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申请号： US11001575申请日： 2004-12-01
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公开(公告)号： US20050170612A1公开(公告)日： 2005-08-04
- 发明人: Atsushi Miyanari , Kosuke Doi , Ken Miyagi , Yoshihiro Inao , Koichi Misumi
- 申请人： Atsushi Miyanari , Kosuke Doi , Ken Miyagi , Yoshihiro Inao , Koichi Misumi
- 申请人地址： JP Kanagawa
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kanagawa
- 优先权： JP2003-402200 20031201; JP2004-343477 20041129
- 主分类号： C09J5/00
- IPC分类号： C09J5/00 ; C09J133/00 ; C09J161/06 ; H01L21/02 ; H01L21/30 ; H01L21/301 ; H01L21/304 ; H01L21/68 ; H01L21/683 ; H01L21/78
摘要：
A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.
公开/授权文献
- US07268061B2 Substrate attaching method 公开/授权日：2007-09-11
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