Invention Application
- Patent Title: Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
- Patent Title (中): 控制工件支撑体表面空间温度分布的方法和装置
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Application No.: US11001219Application Date: 2004-11-30
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Publication No.: US20050173404A1Publication Date: 2005-08-11
- Inventor: Neil Benjamin , Robert Steger
- Applicant: Neil Benjamin , Robert Steger
- Assignee: Lam Research Corporation, a Delaware Corporation
- Current Assignee: Lam Research Corporation, a Delaware Corporation
- Main IPC: C23F4/00
- IPC: C23F4/00 ; H01L21/00 ; H01L21/02 ; H01L21/3065 ; H01L21/683 ; H05B3/68
Abstract:
A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.
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