发明申请
- 专利标题: Low application temperature elastic attachment adhesive
- 专利标题(中): 低应用温度弹性附着胶
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申请号: US10773542申请日: 2004-02-06
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公开(公告)号: US20050176867A1公开(公告)日: 2005-08-11
- 发明人: Qiwei He , Michael Harwell , Ju-ming Hung , Martin Riswick , Wei Kong , Kenneth Martin , Tahir Iqbal
- 申请人: Qiwei He , Michael Harwell , Ju-ming Hung , Martin Riswick , Wei Kong , Kenneth Martin , Tahir Iqbal
- 主分类号: C08L53/02
- IPC分类号: C08L53/02 ; C09J153/02 ; C08K5/01
摘要:
Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275° F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.
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