发明申请
- 专利标题： Chip package sealing method
- 专利标题（中）： 芯片封装封装方法
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申请号： US11105635申请日： 2005-04-14
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公开(公告)号： US20050189332A1公开(公告)日： 2005-09-01
- 发明人: Brian Farrell , Paul Jaynes , Malcolm Taylor
- 申请人： Brian Farrell , Paul Jaynes , Malcolm Taylor
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/04 ; H01L23/06 ; H01L23/10 ; B23K26/20
摘要：
A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
公开/授权文献
- US07972901B2 Chip package sealing method 公开/授权日：2011-07-05
信息查询
IPC分类:
