发明申请
US20050189614A1 CONFIGURABLE INTEGRATED CIRCUIT CAPACITOR ARRAY USING VIA MASK LAYERS
有权
可配置的集成电路电容器阵列使用掩模层
- 专利标题： CONFIGURABLE INTEGRATED CIRCUIT CAPACITOR ARRAY USING VIA MASK LAYERS
- 专利标题（中）： 可配置的集成电路电容器阵列使用掩模层
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申请号： US10906527申请日： 2005-02-23
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公开(公告)号： US20050189614A1公开(公告)日： 2005-09-01
- 发明人: David Ihme , James Kemerling , William Cox
- 申请人： David Ihme , James Kemerling , William Cox
- 主分类号： H01G4/30
- IPC分类号： H01G4/30 ; H01G4/38 ; H01L23/522 ; H01L27/08 ; H01L29/00
摘要：
A semiconductor device having a plurality of layers and a capacitor array that includes a plurality of individual capacitors. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections and capacitances of the plurality of individual capacitors in the capacitor array. The semiconductor device may include a metal structure disposed within the device to provide an electromagnetic shield for at least one of the plurality of individual capacitors in the capacitor array.