发明申请
- 专利标题： Method and apparatus for semiconductor processing
- 专利标题（中）： 用于半导体处理的方法和装置
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申请号： US10927703申请日： 2004-08-27
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公开(公告)号： US20050194096A1公开(公告)日： 2005-09-08
- 发明人: J.B. Price , Jed Keller , Laurence Dulmage , David Cheng
- 申请人： J.B. Price , Jed Keller , Laurence Dulmage , David Cheng
- 专利权人： Crossing Automation, Inc.
- 当前专利权人： Crossing Automation, Inc.
- 主分类号： C23F1/00
- IPC分类号： C23F1/00 ; H01L20060101 ; H01L21/00 ; H01L21/677
摘要：
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.