发明申请
- 专利标题: Processing probe
- 专利标题(中): 加工探头
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申请号: US11066063申请日: 2005-02-25
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公开(公告)号: US20050199809A1公开(公告)日: 2005-09-15
- 发明人: Shigeru Wakiyama , Osamu Takaoka , Masatoshi Yasutake
- 申请人: Shigeru Wakiyama , Osamu Takaoka , Masatoshi Yasutake
- 优先权: JP2004-072658 20040315
- 主分类号: G01N23/00
- IPC分类号: G01N23/00 ; G03F1/72 ; G03F1/74
摘要:
A processing probe capable of repairing a mask-pattern without any damage by preventing electric discharge between the mask patterns, which is caused by electrostatic electrification due to friction between a probe and a mask glass substrate, in repairing a black defect (a convex defect) of a photo-mask with the probe microscope technique is provided. A probe used for mechanically scratching a defective portion is arranged to have conductively. This allows static electricity due to friction in processing to be released from the probe, a cantilever and a cantilever holding member to a square body of an apparatus to prevent electrostatic electrification of a mask glass substrate, and thereby, to prevent electric discharge between mask patterns, so that the mask pattern can be repaired without any damage.
公开/授权文献
- US07378654B2 Processing probe 公开/授权日:2008-05-27
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