发明申请
US20050206898A1 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
失效
用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统
- 专利标题： Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
- 专利标题（中）： 用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统
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申请号： US11131378申请日： 2005-05-18
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公开(公告)号： US20050206898A1公开(公告)日： 2005-09-22
- 发明人: Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
- 申请人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
- 优先权： JP2002-047852 20020225
- 主分类号： G01B11/00
- IPC分类号： G01B11/00 ; G01B11/27 ; H01L21/027 ; H01L21/66 ; H05K1/02 ; H05K3/46
摘要：
An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.