发明申请
- 专利标题： Heat dissipation device
- 专利标题（中）： 散热装置
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申请号： US11020080申请日： 2004-12-21
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公开(公告)号： US20050207118A1公开(公告)日： 2005-09-22
- 发明人: Gen-Cai Wang , Yi-Chyng Fang
- 申请人： Gen-Cai Wang , Yi-Chyng Fang
- 申请人地址： TW Taipei Hsien
- 专利权人： HON HAI Precision Industry CO., LTD.
- 当前专利权人： HON HAI Precision Industry CO., LTD.
- 当前专利权人地址： TW Taipei Hsien
- 优先权： CN200420043899.7 20040318
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/467 ; H05K7/20
摘要：
A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.
公开/授权文献
- US07139171B2 Heat dissipation device 公开/授权日：2006-11-21
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