发明申请
US20050212176A1 Heated medium supplying method and structure for secondary molding of resin molding component
失效
加热介质供应方法和结构,用于树脂成型部件的二次成型
- 专利标题: Heated medium supplying method and structure for secondary molding of resin molding component
- 专利标题(中): 加热介质供应方法和结构,用于树脂成型部件的二次成型
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申请号: US11086218申请日: 2005-03-22
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公开(公告)号: US20050212176A1公开(公告)日: 2005-09-29
- 发明人: Hidehisa Nasu , Akira Kuroyanagi , Masato Ichikawa , Akira Sahashi
- 申请人: Hidehisa Nasu , Akira Kuroyanagi , Masato Ichikawa , Akira Sahashi
- 优先权: JP2004-089198 20040325
- 主分类号: B29C45/26
- IPC分类号: B29C45/26 ; B29C45/00 ; B29C45/14 ; B29C45/17 ; B29C45/72 ; B29C45/73 ; B29L23/00
摘要:
A hot-air supply structure (1) comprises a hot air generator (20) and a housing (15) formed in the neighborhood of a hot-air inlet (81) of a molded component M in a die (10). A nozzle (21) is formed at the forward end of the hot-air generator, and an ejection port (211b) is formed on the side wall portion of the forward end needle unit (211) of the nozzle. The housing includes a support hole (151) in the nozzle, a relief hole (152), a flow path communication passage (153) and a bypass (154). The ejection port is movable between a first position to discharge the cool or warm air into the atmosphere through the bypass from the relief hole and a second position to introduce hot air into the flow path (8) of the molded component through the inlet (81) and the passage (153).
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