Integrated internal power supply with a power inlet connector arranged to protrude through a housing of an end-use equipment, and having internal circuitry potted in a thermally conducting material. A vent path is provided so that a component such as a large capacity electrolytic capacitor can vent surplus fluid, e.g. electrolyte and/or gas. The power supply has a standardized ‘footprint’ and may be mounted directly onto a circuit board in the end-use equipment. The supply is preferably assembled by mounting a board holder on an internal circuit board, mounting a clip on the power inlet connector, mounting the internal circuit board in a case, plugging a vent hole in the internal circuit board, filling the case with potting compound, baking the power supply, preferably at 100° C. for 10 minutes, and then unplugging the vent hole.