发明申请
- 专利标题： Printed-circuit board and electronic device
- 专利标题（中）： 印刷电路板和电子设备
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申请号： US11017712申请日： 2004-12-22
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公开(公告)号： US20050213309A1公开(公告)日： 2005-09-29
- 发明人: Yoshiaki Hiratsuka , Yoshiro Tanaka
- 申请人： Yoshiaki Hiratsuka , Yoshiro Tanaka
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2004-085781 20040323
- 主分类号： H05K9/00
- IPC分类号： H05K9/00 ; H05K1/00 ; H05K1/02 ; H05K1/18
摘要：
A printed-circuit board includes a shield pattern layer that is stacked on a surface layer with respect to at least one wiring pattern layer that includes a wide-pattern area having a wiring width of more than 1 millimeter. Moreover, the shield pattern layer includes a shield pattern that is, from a plane view, overlapped on the wide-pattern area, and grounded without being electrically connected to an internal layer of other wiring pattern layers.
公开/授权文献
- US07301097B2 Printed-circuit board and electronic device 公开/授权日：2007-11-27