Invention Application
US20050214978A1 Lower profile flexible substrate package for electronic components
审中-公开
用于电子元件的下表面柔性基板封装
- Patent Title: Lower profile flexible substrate package for electronic components
- Patent Title (中): 用于电子元件的下表面柔性基板封装
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Application No.: US10807830Application Date: 2004-03-24
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Publication No.: US20050214978A1Publication Date: 2005-09-29
- Inventor: Brian Taggart , Robert Nickerson , Ronald Spreitzer
- Applicant: Brian Taggart , Robert Nickerson , Ronald Spreitzer
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L23/498
Abstract:
Buildup layers may be formed over a flexible substrate. A suitable cavity may be formed in the buildup layers and a silicon die may be positioned over the flexible substrate on a die attach formed within the cavity. As a result, a lower profile flexible substrate package is possible.
Information query
IPC分类:
