发明申请
- 专利标题： Method of wafer/substrate bonding
- 专利标题（中）： 晶片/基板接合方法
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申请号： US10512711申请日： 2002-04-30
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公开(公告)号： US20050215028A1公开(公告)日： 2005-09-29
- 发明人: Jun Wei , Zhiping Wang , Hong Xie
- 申请人： Jun Wei , Zhiping Wang , Hong Xie
- 国际申请： PCT/SG02/00072 WO 20020430
- 主分类号： C03C27/04
- IPC分类号： C03C27/04 ; C04B37/00 ; C04B37/04 ; H01L21/58 ; H01L21/46 ; H01L21/30
摘要：
A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer (2) on one of the components (1,4) and arranging the components (1,4) in spaced relationship with the intermediate layer (2) therebetween. The method further comprises heating one or both of the components (1,4) before bringing the components (1,4) into contact. Finally, a voltage is applied to the components (1,4) to create a permanent bond between the two components.
公开/授权文献
- US07192841B2 Method of wafer/substrate bonding 公开/授权日：2007-03-20