发明申请
- 专利标题： Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
- 专利标题（中）： 具有收缩剥离膜的切割膜和使用其的半导体封装的制造方法
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申请号： US11009246申请日： 2004-12-10
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公开(公告)号： US20050215032A1公开(公告)日： 2005-09-29
- 发明人: Joon Seo , Hyuk Moon , Cheol Han , Jong Lee , Kyung Wi
- 申请人： Joon Seo , Hyuk Moon , Cheol Han , Jong Lee , Kyung Wi
- 优先权： KR10-2004-0020434 20040325
- 主分类号： C09J7/02
- IPC分类号： C09J7/02 ; C09J5/00 ; C09J7/00 ; H01L21/301 ; H01L21/304 ; H01L21/58 ; H01L21/68 ; H01L21/78
摘要：
The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
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