发明申请
- 专利标题： Feed-through process and amplifier with feed-through
- 专利标题（中）： 直通过程和放大器与馈通
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申请号： US10516886申请日： 2003-05-22
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公开(公告)号： US20050215054A1公开(公告)日： 2005-09-29
- 发明人: Frank Rasmussen , Jorgen Skindhoj , Anders Petersen
- 申请人： Frank Rasmussen , Jorgen Skindhoj , Anders Petersen
- 优先权： DKPA200200874 20020607
- 国际申请： PCT/DK03/00339 WO 20030522
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; H01L21/768 ; H01L21/308 ; H01L29/40
摘要：
The invention concerns a process for generating a feed-through in a semiconductor wafer, which has electric circuitry embedded in a front surface whereby the hole for the feed-through is generated by the combined use of a front side protection layer and a wet KOH etch process etching the hole from the back side of the wafer, where a photomasking process is subsequently used do define the via followed by deposition of the via material.
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