发明申请
- 专利标题： Configuring apparatus and processing method of thermal conductive plate
- 专利标题（中）： 配置导热板的设备和加工方法
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申请号： US10816920申请日： 2004-04-05
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公开(公告)号： US20050218190A1公开(公告)日： 2005-10-06
- 发明人: Meng-Cheng Huang , Wen-Hae Tseng , Tony Wang
- 申请人： Meng-Cheng Huang , Wen-Hae Tseng , Tony Wang
- 主分类号： B23K1/18
- IPC分类号： B23K1/18 ; B23K37/04
摘要：
This invention provides a configuring apparatus and a processing method for a thermal conductive plate, which uses high-temperature fusion to seal a top plate and a bottom plate of the thermal conductive plate together. Thereby, the sealing condition is improved to enhance yield. Further, the processing method speeds up fabrication of the thermal conductive plate to aid in execution of automatic process.
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