A mounting board of a camera module of a mobile phone is screwed to an outer cover through cushions formed of rubber, sponge or the like. A solid state imaging device and an optical unit of the camera module are contained in an opening formed in the outer cover and do not contact the outer cover. The mounting board is connected to a main substrate through a flexible board. Accordingly, even if the mobile phone is dropped down, the camera module is prevented from breakage by the vibration or the shock applied to the mobile phone, because the vibration and the shock are not transmitted to the camera module directly.