发明申请
- 专利标题： Printed circuit board and electronic apparatus using the same
- 专利标题（中）： 印刷电路板和使用其的电子设备
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申请号： US11094284申请日： 2005-03-31
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公开(公告)号： US20050219829A1公开(公告)日： 2005-10-06
- 发明人: Kuo-Chun Lee
- 申请人： Kuo-Chun Lee
- 专利权人： BENQ CORPORATION
- 当前专利权人： BENQ CORPORATION
- 优先权： TW93109211 20040402
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K1/11 ; H05K3/30
摘要：
A printed circuit board and an electronic apparatus utilizing the same. The electronic apparatus includes the printed circuit board and a dual-inline-package (DIP) device. The printed circuit board includes a pair of holes. The pair of holes has a geometrical center, and is substantially symmetrical with respect to the geometric center so that each hole is arc-shaped. The DIP device includes a pair of pins, and is disposed on the printed circuit board by inserting the pins into the holes.
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