发明申请
- 专利标题： Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
- 专利标题（中）： 半导体装置的制造方法以及使用基板夹具固定半导体装置的方法
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申请号： US11075721申请日： 2005-03-10
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公开(公告)号： US20050221588A1公开(公告)日： 2005-10-06
- 发明人: Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
- 申请人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2001-322811 20011019
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/00 ; H01L21/301 ; H01L21/304 ; H01L21/52 ; H01L21/58 ; H01L21/60 ; H01L21/683 ; H01L21/687
摘要：
The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
公开/授权文献
- US07395847B2 Jig for a semiconductor substrate 公开/授权日：2008-07-08