发明申请
- 专利标题： Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process
- 专利标题（中）： 化学机械抛光垫，其生产方法和化学机械抛光工艺
-
申请号： US11050730申请日： 2005-02-07
-
公开(公告)号： US20050222336A1公开(公告)日： 2005-10-06
- 发明人: Takahiro Okamoto , Hiroyuki Miyauchi , Kouji Kawahara , Hiroshi Shiho , Kou Hasegawa , Nobuo Kawahashi
- 申请人： Takahiro Okamoto , Hiroyuki Miyauchi , Kouji Kawahara , Hiroshi Shiho , Kou Hasegawa , Nobuo Kawahashi
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-029393 20040205; JP2004-173410 20040611; JP2004-215931 20040723
- 主分类号： B24B37/24
- IPC分类号： B24B37/24 ; B24D13/14 ; B24D18/00 ; C08F8/00
摘要：
A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (A) a styrene polymer and (B) a diene polymer. A method for producing the above chemical mechanical polishing pad, the method comprising the steps of preparing a composition comprising (A) a styrene polymer, (B) a diene polymer and (C) a crosslinking agent, shaping the above composition into a predetermined shape, and heating the composition during or after shaping to cure it. A chemical mechanical polishing process which comprises polishing a surface to be polished of an object to be polished by use of the chemical mechanical polishing pad. According to the present invention, it is possible to provide a chemical mechanical polishing pad which can be suitably applied to polishing of metal film and insulation film, particularly to an STI technique, provides a flat polished surface, can provide a high polishing rate and has a satisfactory useful life.
信息查询
