- 专利标题： Electronic component mounting method and apparatus
-
申请号： US11150383申请日： 2005-06-13
-
公开(公告)号： US20050224974A1公开(公告)日： 2005-10-13
- 发明人: Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
- 申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
- 优先权： JP11-21800 19990129; JP11-22015 19990129
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H05K3/32 ; H01L23/52 ; H01L21/44
摘要：
A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.
信息查询
IPC分类:
