发明申请
US20050224987A1 Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
审中-公开
在铜金属化集成电路上具有双重覆盖保护的可焊接金属插头的接触焊盘的结构和方法
- 专利标题： Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
- 专利标题（中）： 在铜金属化集成电路上具有双重覆盖保护的可焊接金属插头的接触焊盘的结构和方法
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申请号： US10820620申请日： 2004-04-07
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公开(公告)号： US20050224987A1公开(公告)日： 2005-10-13
- 发明人: Edgardo Hortaleza , Lei Li
- 申请人： Edgardo Hortaleza , Lei Li
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L29/40
摘要：
An integrated circuit having copper interconnecting metallization (311, 312) protected by a first overcoat layer (320), portions of the metallization exposed in windows (301, 302) opened through the thickness of the first overcoat layer. A patterned conductive barrier layer (330) is positioned on the exposed portion of the copper metallization and on portions of the first overcoat layer surrounding the window. A bondable metal layer (350, 351) is positioned on the barrier layer; the thickness of this bondable layer is suitable for wire bonding. A second overcoat layer (360) including insulating silicon compounds is positioned on the first overcoat layer so that the edge (362) of the second overcoat layer overlays the edge of the bondable layer positioned on the portions (321) of the first overcoat layer surrounding the window.
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