Invention Application
US20050230850A1 Microelectronic assembly having a redistribution conductor over a microelectronic die
审中-公开
微电子组件在微电子管芯上具有再分布导体
- Patent Title: Microelectronic assembly having a redistribution conductor over a microelectronic die
- Patent Title (中): 微电子组件在微电子管芯上具有再分布导体
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Application No.: US10829039Application Date: 2004-04-20
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Publication No.: US20050230850A1Publication Date: 2005-10-20
- Inventor: Brian Taggart , Robert Nickerson , Ronald Spreitzer
- Applicant: Brian Taggart , Robert Nickerson , Ronald Spreitzer
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H01L23/52
Abstract:
A microelectronic assembly is provided, having redistribution conductors that are formed over a microelectronic die of the assembly instead of through a substrate to which the microelectronic die is mounted. A redistribution conductor is formed by a pair of contacts on the die and a conductive portion connecting the contacts to one another. A wirebonding wire is attached to each contact. One of the wirebonding wires may be used to connect to a terminal on the substrate, a terminal on another die, or to another contact on the same die.
Information query
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