Invention Application
- Patent Title: Temperature sensor
- Patent Title (中): 温度感应器
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Application No.: US11031814Application Date: 2005-01-06
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Publication No.: US20050232334A1Publication Date: 2005-10-20
- Inventor: Yun-Ching Ma , Zack Lin , Ching-Han Yu
- Applicant: Yun-Ching Ma , Zack Lin , Ching-Han Yu
- Applicant Address: TW Hsinchu
- Assignee: Polytronics Technology Corporation
- Current Assignee: Polytronics Technology Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW093110709 20040416
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K7/22 ; H01C1/14

Abstract:
A temperature sensor comprises at least one temperature sensing device and a sensing circuit. The temperature sensing device comprises a first electrode layer, a second electrode layer and a current-sensitive layer, wherein at least one of the first and second electrode layers comprises two electrically separated electrode plates, and the current-sensitive layer is laminated between the first and second electrode layers. The current-sensitive layer is made of PTC or NTC material, and the sidewalls are not plated with conductive films. The sensing circuit is electrically coupled to the temperature sensing device to read temperatures.
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