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发明申请
US20050233122A1 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein 审中-公开
层叠基板的制造方法以及用于其中的模块和层压基板的半导体装置的制造装置

Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
摘要：
The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.
摘要（中）：

本发明提供一种能够实现小型便携式电子设备的层压基板的制造方法。 预浸料141是在第一温度范围内保持板状的热固性树脂，在第二温度范围内具有热流动性，并且在第三温度范围内固化，积分过程（118）包括加热预浸料（141）的软化（120） 到第二温度范围，并且软化浸渍在预浸料坯（141）中的树脂，在预浸料坯（141）之前压制预浸料坯（141）的强制流动（122）达到第三温度范围，并迫使树脂流入空间和间隙 半导体（105），电阻器（106）和基板（101），以及加热预浸料（141）的硬化（123）至第三温度范围。 结果，在不使用中间材料的情况下，可以用树脂牢固地填充半导体（105），电阻器（106）和基板（101）之间形成的空间和间隙。

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