发明申请
- 专利标题： Patterning process and resist overcoat material
- 专利标题（中）： 图案过程和抗大衣材料
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申请号： US11105510申请日： 2005-04-14
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公开(公告)号： US20050233254A1公开(公告)日： 2005-10-20
- 发明人: Jun Hatakeyama , Yuji Harada
- 申请人： Jun Hatakeyama , Yuji Harada
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 优先权： JP2004-121506 20040416; JP2004-244030 20040824; JP2004-305183 20041020
- 主分类号： G03F7/11
- IPC分类号： G03F7/11 ; G03F7/20 ; G03C1/492
摘要：
In an immersion lithography process, a pattern is formed by forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from a resist overcoat material, exposing the layer structure to light in water, and developing. A water-insoluble, alkali-soluble material is used as the resist overcoat material.
公开/授权文献
- US07455952B2 Patterning process and resist overcoat material 公开/授权日：2008-11-25