发明申请
- 专利标题: Toughening of thermosets
- 专利标题(中): 热固性增韧
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申请号: US10519251申请日: 2003-06-27
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公开(公告)号: US20050234143A1公开(公告)日: 2005-10-20
- 发明人: Ho Kim , Nam Kim
- 申请人: Ho Kim , Nam Kim
- 优先权: AUPS3238 20020627
- 国际申请: PCT/AU03/00821 WO 20030627
- 主分类号: B29C70/66
- IPC分类号: B29C70/66 ; C08J9/32 ; C08K7/22 ; C08J9/16 ; C08L63/00
摘要:
A method of manufacturing thermosets such as epoxy resins includes adding expandable hollow microspheres, which expand with temperature as shown in the accompanying graph, to the base thermoset components in the liquid phase and applying heat treatment to the mixture so formed causing the micropsheres to expand during or after curing of the thermoset. This results in a toughening mechanism caused by compressive residual stress around the microspheres which significantly increases the specific fracture energy of the epoxy resin.
公开/授权文献
- US07550521B2 Toughening of thermosets 公开/授权日:2009-06-23
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