发明申请
US20050234143A1 Toughening of thermosets 失效
热固性增韧

  • 专利标题: Toughening of thermosets
  • 专利标题(中): 热固性增韧
  • 申请号: US10519251
    申请日: 2003-06-27
  • 公开(公告)号: US20050234143A1
    公开(公告)日: 2005-10-20
  • 发明人: Ho KimNam Kim
  • 申请人: Ho KimNam Kim
  • 优先权: AUPS3238 20020627
  • 国际申请: PCT/AU03/00821 WO 20030627
  • 主分类号: B29C70/66
  • IPC分类号: B29C70/66 C08J9/32 C08K7/22 C08J9/16 C08L63/00
Toughening of thermosets
摘要:
A method of manufacturing thermosets such as epoxy resins includes adding expandable hollow microspheres, which expand with temperature as shown in the accompanying graph, to the base thermoset components in the liquid phase and applying heat treatment to the mixture so formed causing the micropsheres to expand during or after curing of the thermoset. This results in a toughening mechanism caused by compressive residual stress around the microspheres which significantly increases the specific fracture energy of the epoxy resin.
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