发明申请
- 专利标题: Releasable adhesive composition
- 专利标题(中): 可释放的粘合剂组合物
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申请号: US11051639申请日: 2005-01-27
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公开(公告)号: US20050234169A1公开(公告)日: 2005-10-20
- 发明人: Jang Kim , Woo Kim , Jae Lee , Suk Chang , Wook Kim , Geun Lee , Byoung Lee
- 申请人: Jang Kim , Woo Kim , Jae Lee , Suk Chang , Wook Kim , Geun Lee , Byoung Lee
- 优先权: KR10-2004-0005386 20040128
- 主分类号: C09J133/10
- IPC分类号: C09J133/10 ; C08G63/02 ; C09J7/00 ; C09J7/02 ; C09J11/00 ; C09J133/00 ; C09J133/02 ; C09J133/12
摘要:
The present invention provides an adhesive composition comprising an adhesive polymer resin and an organic crystalline material having a higher melting point than the maximum acceptable operating temperature of products where the adhesive is used, as well as an adhesive sheet prepared therefrom. The adhesive composition and adhesive sheet of the present invention maintain excellent adhesion strength at their use temperature and show a rapid reduction in adhesion at a higher temperature than the melting point of the organic crystalline material so as to allow release from substrates.
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