发明申请
US20050245051A1 Parting method for fragile material substrate and parting device using the method
失效
使用该方法的脆性材料基板和分型装置的分离方法
- 专利标题： Parting method for fragile material substrate and parting device using the method
- 专利标题（中）： 使用该方法的脆性材料基板和分型装置的分离方法
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申请号： US10509895申请日： 2003-04-01
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公开(公告)号： US20050245051A1公开(公告)日： 2005-11-03
- 发明人: Kazuya Maekawa , Hiroshi Soyama
- 申请人： Kazuya Maekawa , Hiroshi Soyama
- 申请人地址： JP Suita-city, Osaka 564-0044
- 专利权人： MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人： MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人地址： JP Suita-city, Osaka 564-0044
- 优先权： JP2002-98397 20020401
- 国际申请： PCT/JP03/04159 WO 20030401
- 主分类号： B28D5/00
- IPC分类号： B28D5/00 ; C03B33/033 ; C03B33/07 ; C03B33/10 ; H01L21/46
摘要：
There are provided a scribing step of performing scribing in a state in which a protective material is applied on at least one surface of a brittle material substrate, and a first scribing device that performs this scribing step. Accordingly, it is possible to form a vertical crack that reaches deep inside of the substrate, while effectively removing cullets produced at the time of severing the substrate, thus performing precise severing along a scribe line.
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