发明申请
- 专利标题： Memory module, socket and mounting method providing improved heat dissipating characteristics
- 专利标题（中）： 内存模块，插座和安装方法，提供改善的散热特性
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申请号： US11093236申请日： 2005-03-30
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公开(公告)号： US20050245137A1公开(公告)日： 2005-11-03
- 发明人: Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
- 申请人： Sang-Wook Park , Joong-Hyun Baek , Hae-Hyung Lee , Hee-Kook Choi , Jin-Yang Lee
- 优先权： KR2004-22027 20040331
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01R13/62 ; H05K3/30
摘要：
In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.
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