发明申请
US20050248013A1 Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
有权
具有与多个引线的相同表面电连接的两个或更多个半导体器件的接合焊盘的组件
- 专利标题： Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
- 专利标题（中）： 具有与多个引线的相同表面电连接的两个或更多个半导体器件的接合焊盘的组件
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申请号： US11182160申请日： 2005-07-15
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公开(公告)号： US20050248013A1公开(公告)日： 2005-11-10
- 发明人: Todd Bolken
- 申请人： Todd Bolken
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/495 ; H01L23/34
摘要：
A semiconductor device includes two or more semiconductor devices with bond pads that are electrically connected to the same, single surface of a plurality of leads. The two or more devices may include substantially centrally located bond pads or substantially identically arranged bond pads.
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