发明申请
US20050248489A1 MULTI-BAND MULTI-LAYERED CHIP ANTENNA USING DOUBLE COUPLING FEEDING
失效
使用双重耦合馈线的多层多层芯片天线
- 专利标题: MULTI-BAND MULTI-LAYERED CHIP ANTENNA USING DOUBLE COUPLING FEEDING
- 专利标题(中): 使用双重耦合馈线的多层多层芯片天线
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申请号: US10859145申请日: 2004-06-03
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公开(公告)号: US20050248489A1公开(公告)日: 2005-11-10
- 发明人: Hyun Kim , Chul Kim , Gi Do , Jeong Seo , Il Park
- 申请人: Hyun Kim , Chul Kim , Gi Do , Jeong Seo , Il Park
- 优先权: KR2004-31297 20040504
- 主分类号: H01Q13/08
- IPC分类号: H01Q13/08 ; H01Q20060101 ; H01Q1/24 ; H01Q1/36 ; H01Q1/38 ; H01Q5/10 ; H01Q5/385 ; H01Q9/04 ; H01Q9/42 ; H01Q23/00
摘要:
Disclosed herein is a multi-layered chip antenna using double coupling feeding. The multi-layered chip antenna comprises a first feeding radiation element including a first feeding electrode connected at one side of the first feeding electrode to a feeding line and connected at the other side thereof to a ground surface while being formed on a first plane in a predetermined direction, the first feeding radiation element being connected to the first feeding electrode so that the first feeding radiation element has a spatial meander line structure, a second feeding radiation element connected to a portion of the first feeding electrode on a second plane parallel to the first plane such that the second feeding radiation element has a planar meander line structure, a second feeding electrode connected to a portion of the first feeding electrode on a third plane parallel to the first plane, a first parasitic radiation element electrically coupled to the second feeding electrode, and a second parasitic radiation element electrically coupled to the second feeding electrode and comprising a plurality of parasitic patterns.
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