发明申请
- 专利标题: Thermal sensing
- 专利标题(中): 热传感
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申请号: US11167746申请日: 2005-06-27
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公开(公告)号: US20050254552A1公开(公告)日: 2005-11-17
- 发明人: Richard Bruce , Dirk De Bruyker , Francisco Torres , Michal Wolkin
- 申请人: Richard Bruce , Dirk De Bruyker , Francisco Torres , Michal Wolkin
- 专利权人: Palo Alto Research Center Incorporated
- 当前专利权人: Palo Alto Research Center Incorporated
- 主分类号: G01F1/68
- IPC分类号: G01F1/68 ; G01K1/00 ; G01K7/30 ; G01K17/00 ; G01N25/20 ; G01N25/48 ; G01N27/00
摘要:
In thermal sensing devices, such as for calorimetry, a support layer or central layer can have a thermometer element or other thermal sensor on one side and a thermally conductive structure or component on the other. The thermally conductive structure can conduct temperature or other thermal input signals laterally across the support layer or central layer. The temperature or signals can then be provided to the thermometer element, such as by thermal contact through the support layer. An electrically conducting, thermally isolating anti-coupling layer, such as of gold or chromium, can reduce capacitive coupling between the thermally conductive structure and the thermometer element or other thermal sensor.
公开/授权文献
- US07473030B2 Thermal sensing 公开/授权日:2009-01-06
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