发明申请
- 专利标题： Polishing apparatus and method
- 专利标题（中）： 抛光设备和方法
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申请号： US11187944申请日： 2005-07-25
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公开(公告)号： US20050260933A1公开(公告)日： 2005-11-24
- 发明人: Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
- 申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
- 优先权： JP2000-102669 20000404; JP2000-163082 20000531
- 主分类号： B24B9/06
- IPC分类号： B24B9/06 ; B24B37/12 ; B24B37/34 ; H01L21/00 ; B24B49/00
摘要：
A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
公开/授权文献
- US07108589B2 Polishing apparatus and method 公开/授权日：2006-09-19
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