发明申请
- 专利标题： Multilayer printed wiring board and multilayer printed circuit board
- 专利标题（中）： 多层印刷线路板和多层印刷电路板
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申请号： US11134426申请日： 2005-05-23
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公开(公告)号： US20050263884A1公开(公告)日： 2005-12-01
- 发明人: Yasuhiro Sawada
- 申请人： Yasuhiro Sawada
- 申请人地址： JP TOKYO
- 专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人地址： JP TOKYO
- 优先权： JP2004-156991 20040527; JP2005-141087 20050513
- 主分类号： H01L23/053
- IPC分类号： H01L23/053 ; H01L23/498 ; H05K1/00 ; H05K1/02 ; H05K1/11
摘要：
In a multilayer printed wiring board having a plurality of laminated resin layers, a plurality of wiring patterns formed on the interfacial surface of the resin layers, and a plurality of lands formed on the outermost layer of the resin layers and on which the solder is provided, at least one of the wiring patterns has a plurality of openings in the form of a mesh, the size of openings of the wiring patterns in a region corresponding to the position of solder in which a stress generated in the solder provided on the lands becomes a value larger than a desired value due to thermal deformation of the semiconductor device and the multilayer printed wiring board is larger than that of openings in the other regions.
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