发明申请
- 专利标题： Semiconductor device having adhesion increasing film and method of fabricating the same
- 专利标题（中）： 具有增粘膜的半导体装置及其制造方法
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申请号： US11143293申请日： 2005-06-01
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公开(公告)号： US20050269698A1公开(公告)日： 2005-12-08
- 发明人: Osamu Okada , Hiroyasu Jobetto
- 申请人： Osamu Okada , Hiroyasu Jobetto
- 申请人地址： JP Tokyo
- 专利权人： Casio Computer Co., Ltd.
- 当前专利权人： Casio Computer Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-164363 20040602
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/44 ; H01L21/56 ; H01L21/60 ; H01L23/31 ; H01L23/48 ; H01L23/538
摘要：
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.