发明申请
- 专利标题: Method and system for improved wire bonding
- 专利标题(中): 改善引线接合的方法和系统
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申请号: US10864025申请日: 2004-06-09
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公开(公告)号: US20050275073A1公开(公告)日: 2005-12-15
- 发明人: Norihiro Kawakami , Yoshikatsu Umeda , Souichi Kadoguchi , Hiroyuki Fujii
- 申请人: Norihiro Kawakami , Yoshikatsu Umeda , Souichi Kadoguchi , Hiroyuki Fujii
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 主分类号: B23K20/00
- IPC分类号: B23K20/00 ; H01L21/60 ; H01L23/02 ; H01L23/49
摘要:
According to one embodiment of the invention, a method for coupling electrical contacts is provided. The method includes providing an electronic component having a contact that is to be coupled to another contact. The method also includes forming, over the contact, a bonded ball having a downwardly sloping shoulder that extends from a point and ends at an edge of the shoulder. The downwardly sloping shoulder has an angle between 105-130 degrees from a first imaginary vertical line that intersects the point. The downwardly sloping shoulder does not have a structure that makes contact with the electronic component and also extends in an outward direction from a second imaginary vertical line intersecting the edge of the shoulder. The method also includes coupling the bonded ball to the another contact using a wire.