发明申请
- 专利标题： Micro-relay and method of fabricating the same
- 专利标题（中）： 微型继电器及其制造方法
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申请号： US10634876申请日： 2003-08-06
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公开(公告)号： US20050280975A1公开(公告)日： 2005-12-22
- 发明人: Hideki Iwata , Takashi Yuba , Hirofumi Saso
- 申请人： Hideki Iwata , Takashi Yuba , Hirofumi Saso
- 申请人地址： JP Tokyo
- 专利权人： FUJITSU COMPONENT LIMITED
- 当前专利权人： FUJITSU COMPONENT LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2002-232182 20020808; JP2002-232183 20020808; JP2002-232184 20020808; JP2002-324384 20021107
- 主分类号： H01H59/00
- IPC分类号： H01H59/00 ; H01H51/22
摘要：
A micro-relay includes a first substrate having stationary contacts and a stationary electrode, a second substrate arranged so as to face the first substrate, and a movable plate arranged between the first and second substrates. The movable plate has a frame and a movable portion. The frame is sandwiched between the first and second substrates to realize a hermetical sealed structure. The movable portion has a movable electrode facing the stationary electrode, and a movable contact faces the stationary contacts. The movable portion moves between the first and second substrates due to electrostatic attraction that develops between the movable electrode and the stationary electrode.
公开/授权文献
- US07551048B2 Micro-relay and method of fabricating the same 公开/授权日：2009-06-23
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