Invention Application
- Patent Title: Power component cooling device
- Patent Title (中): 动力部件冷却装置
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Application No.: US11153495Application Date: 2005-06-16
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Publication No.: US20050280997A1Publication Date: 2005-12-22
- Inventor: Takashi Maeda
- Applicant: Takashi Maeda
- Assignee: KABUSHIKI KAISHA YASKAWA DENKI
- Current Assignee: KABUSHIKI KAISHA YASKAWA DENKI
- Priority: JPP.2004-178424 20040616
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L25/10 ; H05K7/20

Abstract:
Where power components are fixed on a heat sink 1 inclusive of a heat sink base 1b and cooling fins 1a provided on the heat sink base 1b, one 1c of the cooling fins, which is made thicker, is arranged upright on the heat sink base 1b. And a high heat-generating power component 3 is fixed to the heat sink base 1b and middle heat-generating power components 5, 6 are fixed to the cooling fin 1c.
Public/Granted literature
- US07336495B2 Power component cooling device with a heat sink and one or more cooling fins Public/Granted day:2008-02-26
Information query
IPC分类: