发明申请
- 专利标题： Hybrid substrate and method for fabricating the same
- 专利标题（中）： 混合基板及其制造方法
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申请号： US11202834申请日： 2005-08-12
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公开(公告)号： US20050282323A1公开(公告)日： 2005-12-22
- 发明人: Louis Hsu , Li-Kong Wang
- 申请人： Louis Hsu , Li-Kong Wang
- 申请人地址： US NY Armonk
- 专利权人： IBM Corporation
- 当前专利权人： IBM Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/20
- IPC分类号： H01L21/20 ; H01L27/12 ; D06N7/04 ; G11B5/64 ; H01L21/336 ; H01L21/8234
摘要：
A hybrid substrate, i.e., a substrate fabricated from different materials, and method for fabricating the same are presented. The hybrid substrate is configured for fabricating more than two different devices thereon, has a high thermal conductivity, and is configured for patterning interconnects thereon for interconnecting the different devices fabricated on the hybrid substrate.
公开/授权文献
- US07176107B2 Hybrid substrate and method for fabricating the same 公开/授权日：2007-02-13
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